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Advanced Adhesives in Electronics

Advanced Adhesives in Electronics
  • Author : M O Alam
  • Publsiher : Elsevier
  • Release : 25 May 2011
  • ISBN : 0857092898
  • Pages : 280 pages
  • Rating : 4/5 from 21 ratings
GET THIS BOOKAdvanced Adhesives in Electronics

Summary:
Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties. The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces, modelling techniques used to assess adhesive properties and adhesive technology for photonics. With its distinguished editors and international team of contributors, Advanced adhesives in electronics is a standard reference for materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field. Reviews recent developments in adhesive joining technology, processing and properties featuring flip-chip applications Provides a comprehensive overview of adhesive joining technology for electronics including different types of adhesives used in electronic systems Focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces and modelling techniques


Advanced Adhesives in Electronics

Advanced Adhesives in Electronics
  • Author : M O Alam,C Bailey
  • Publisher : Elsevier
  • Release : 25 May 2011
GET THIS BOOKAdvanced Adhesives in Electronics

Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties. The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part

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Advanced Adhesives in Electronics: Materials, Properties and Applications

Advanced Adhesives in Electronics: Materials, Properties and Applications
  • Author : M. O. Alam,C. Bailey
  • Publisher : Woodhead Publishing
  • Release : 01 June 2011
GET THIS BOOKAdvanced Adhesives in Electronics: Materials, Properties and Applications

Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. This book reviews recent developments in adhesive joining technology, processing and properties.

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Advanced Materials Interfaces

Advanced Materials Interfaces
  • Author : Ashutosh Tiwari,Hirak K. Patra,Xuemei Wang
  • Publisher : John Wiley & Sons
  • Release : 22 June 2016
GET THIS BOOKAdvanced Materials Interfaces

Advanced Material Interfaces is a state-of-the-art look at innovative methodologies and strategies adopted for interfaces and their applications. The 13 chapters are written by eminent researchers not only elaborate complex interfaces fashioned of solids, liquids, and gases, but also ensures cross-disciplinary mixture and blends of physics, chemistry, materials science, engineering and life sciences. Advanced interfaces operate fundamental roles in essentially all integrated devices. It is therefore of the utmost urgency to focus on how newly-discovered fundamental constituents and interfacial progressions can

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Advanced Polymeric Materials

Advanced Polymeric Materials
  • Author : Rouxel, Didier,Thomas, Sabu,Kalarikkal, Nandakumar
  • Publisher : River Publishers
  • Release : 23 May 2018
GET THIS BOOKAdvanced Polymeric Materials

Recent advances in polymer research has led to the generation of high quality materials for various applications in day to day life. The synthesis of new functional monomers has shown strong potential in generating novel polymer materials, with improved properties. Advanced Polymeric Materials includes fundamentals and numerous examples of polymer blend preparation and characterizations. Developments in blends, polymer nanocomposites and its various characterization techniques are highlighted in the book.

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Handbook of Solid-State Lasers

Handbook of Solid-State Lasers
  • Author : B Denker,E Shklovsky
  • Publisher : Elsevier
  • Release : 20 February 2013
GET THIS BOOKHandbook of Solid-State Lasers

Solid-state lasers which offer multiple desirable qualities, including enhanced reliability, robustness, efficiency and wavelength diversity, are absolutely indispensable for many applications. The Handbook of solid-state lasers reviews the key materials, processes and applications of solid-state lasers across a wide range of fields. Part one begins by reviewing solid-state laser materials. Fluoride laser crystals, oxide laser ceramics, crystals and fluoride laser ceramics doped by rare earth and transition metal ions are discussed alongside neodymium, erbium and ytterbium laser glasses, and nonlinear

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Components and Sub-Assemblies

Components and Sub-Assemblies
  • Author : C.G. Wedgwood
  • Publisher : Elsevier
  • Release : 22 October 2013
GET THIS BOOKComponents and Sub-Assemblies

Please note this is a Short Discount publication. Access both contact and company information on all 4950 European manufacturers, distributors and agents for 550 electronics components and sub–assembly product classifications throughout West and East Europe in one comprehensive Volume. Applications: • Sourcing of specific product types through local distributors or manufacturers • Location of new regional channels of distribution or identification of new European business partners • Competitor tracking • Sales lead generation Entries include: • Key names executives • Full address, telephone and fax details • Size

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Introduction to Microsystem Packaging Technology

Introduction to Microsystem Packaging Technology
  • Author : Yufeng Jin,Zhiping Wang,Jing Chen
  • Publisher : CRC Press
  • Release : 29 September 2010
GET THIS BOOKIntroduction to Microsystem Packaging Technology

The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today’s information industry. The packaging process—including design and manufacturing technologies—is the technical foundation upon which function chips are updated for use in application systems, and it is an important guarantee of the continued growth of technical content and value of information systems. Introduction to Microsystem Packaging Technology details the latest advances in this vital area, which involves microelectronics, optoelectronics, RF and wireless, MEMS,

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Advances in Chemical Mechanical Planarization (CMP)

Advances in Chemical Mechanical Planarization (CMP)
  • Author : Suryadevara Babu
  • Publisher : Woodhead Publishing
  • Release : 09 January 2016
GET THIS BOOKAdvances in Chemical Mechanical Planarization (CMP)

Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planarization of multiple metal and dielectric materials and layers both at the device and the metallization levels, using different tools and parameters, requiring improvements in the control of topography and defects. This important book offers a systematic review of

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Advanced Materials Innovation

Advanced Materials Innovation
  • Author : Sanford L. Moskowitz
  • Publisher : John Wiley & Sons
  • Release : 13 September 2016
GET THIS BOOKAdvanced Materials Innovation

Through detailed case studies of the most important advanced material creations of the latter 20th and early 21st century, the author explores the role of the field of advanced materials in the technological and economic activity today, with implications to the innovation process in general. A comprehensive study that encompasses the three major categories of advanced material technologies, i.e., Structural Materials (metals and polymers), Functional Materials (transistor, microchip and semiconductor laser) and Hybrid and New Forms of Matter (liquid

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Handbook of Laser Welding Technologies

Handbook of Laser Welding Technologies
  • Author : S Katayama
  • Publisher : Elsevier
  • Release : 30 June 2013
GET THIS BOOKHandbook of Laser Welding Technologies

Laser welding is a rapidly developing and versatile technology which has found increasing applications in industry and manufacturing. It allows the precision welding of small and hard-to-reach areas, and is particularly suitable for operation under computer or robotic control. The Handbook of laser welding technologies reviews the latest developments in the field and how they can be used across a variety of applications. Part one provides an introduction to the fundamentals of laser welding before moving on to explore developments

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