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Advanced Adhesives in Electronics

Advanced Adhesives in Electronics
  • Author : M O Alam
  • Publsiher : Elsevier
  • Release : 25 May 2011
  • ISBN : 0857092898
  • Pages : 280 pages
  • Rating : 4/5 from 21 ratings
GET THIS BOOKAdvanced Adhesives in Electronics

Summary:
Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties. The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces, modelling techniques used to assess adhesive properties and adhesive technology for photonics. With its distinguished editors and international team of contributors, Advanced adhesives in electronics is a standard reference for materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field. Reviews recent developments in adhesive joining technology, processing and properties featuring flip-chip applications Provides a comprehensive overview of adhesive joining technology for electronics including different types of adhesives used in electronic systems Focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces and modelling techniques


Advanced Adhesives in Electronics

Advanced Adhesives in Electronics
  • Author : M O Alam,C Bailey
  • Publisher : Elsevier
  • Release : 25 May 2011
GET THIS BOOKAdvanced Adhesives in Electronics

Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties. The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part


Advanced Piezoelectric Materials

Advanced Piezoelectric Materials
  • Author : Kenji Uchino
  • Publisher : Elsevier
  • Release : 27 September 2010
GET THIS BOOKAdvanced Piezoelectric Materials

Piezoelectric materials produce electric charges on their surfaces as a consequence of applying mechanical stress. They are used in the fabrication of a growing range of devices such as transducers (used, for example, in ultrasound scanning), actuators (deployed in such areas as vibration suppression in optical and microelectronic engineering), pressure sensor devices (such as gyroscopes) and increasingly as a way of producing energy. Their versatility has led to a wealth of research to broaden the range of piezoelectric materials and


Polymers in Organic Electronics

Polymers in Organic Electronics
  • Author : Sulaiman Khalifeh
  • Publisher : Elsevier
  • Release : 01 April 2020
GET THIS BOOKPolymers in Organic Electronics

Polymers in Organic Electronics: Polymer Selection for Electronic, Mechatronic, and Optoelectronic Systems provides readers with vital data, guidelines, and techniques for optimally designing organic electronic systems using novel polymers. The book classifies polymer families, types, complexes, composites, nanocomposites, compounds, and small molecules while also providing an introduction to the fundamental principles of polymers and electronics. Features information on concepts and optimized types of electronics and a classification system of electronic polymers, including piezoelectric and pyroelectric, optoelectronic, mechatronic, organic electronic complexes,


Electronics Applications of Polymers II

Electronics Applications of Polymers II
  • Author : M.T. Goosey
  • Publisher : iSmithers Rapra Publishing
  • Release : 03 March 2021
GET THIS BOOKElectronics Applications of Polymers II

Electronics applications of polymers continue to advance, and this report describes the major developments in the last decade. The report looks at the important properties of polymers and discusses their role in printed circuit board (PCB) and related interconnect applications and in microelectronics. Additionally, the various lithographic routes available for future semiconductor device manufacture are discussed. An additional indexed section containing several hundred abstracts from the Rapra Polymer Library database gives useful references for further reading.


Waste Electrical and Electronic Equipment (WEEE) Handbook

Waste Electrical and Electronic Equipment (WEEE) Handbook
  • Author : Vannessa Goodship,Ab Stevels
  • Publisher : Elsevier
  • Release : 30 August 2012
GET THIS BOOKWaste Electrical and Electronic Equipment (WEEE) Handbook

Electrical and electronic waste is a growing problem as volumes are increasing fast. Rapid product innovation and replacement, especially in information and communication technologies (ICT), combined with the migration from analog to digital technologies and to flat-screen televisions and monitors has resulted in some electronic products quickly reaching the end of their life. The EU directive on waste electrical and electronic equipment (WEEE) aims to minimise WEEE by putting organizational and financial responsibility on producers and distributors for collection, treatment,




Electrical Conductive Adhesives with Nanotechnologies

Electrical Conductive Adhesives with Nanotechnologies
  • Author : Yi (Grace) Li,Daniel Lu,C.P. Wong
  • Publisher : Springer Science & Business Media
  • Release : 08 October 2009
GET THIS BOOKElectrical Conductive Adhesives with Nanotechnologies

“Electrical Conductive Adhesives with Nanotechnologies” begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives). The material presented focuses on the three ECA categories specifically, Isotropically Conductive Adhesives (ICAs) Anisotropically Conductive Adhesives/Films (ACA/ACF) and Nonconductive Adhesives/Films (NCA/NCF). Discussing the advantages and limitations of each technique, and how each technique is currently applied. Lastly, a detailed presentation of how nano techniques can be applied


Advanced Organics for Electronic Substrates and Packages

Advanced Organics for Electronic Substrates and Packages
  • Author : Andrew E Fletcher
  • Publisher : Elsevier
  • Release : 22 October 2013
GET THIS BOOKAdvanced Organics for Electronic Substrates and Packages

Advanced Organics for Electronic Substrates and Packages provides information on packaging, which is one of the most technologically intensive activities in the electronics industry. The electronics packaging community has realized that while semiconductor devices continue to be improved upon for performance, cost, and reliability, it is the interconnection or packaging of these devices that will limit the performance of the systems. Technology must develop packaging for transistor chips, with high levels of performance and integration providing cooling, power, and interconnection,


Adhesives Technology for Electronic Applications

Adhesives Technology for Electronic Applications
  • Author : James J. Licari,Dale W. Swanson
  • Publisher : William Andrew
  • Release : 24 June 2011
GET THIS BOOKAdhesives Technology for Electronic Applications

Adhesives are widely used in the manufacture and assembly of electronic circuits and products. Generally, electronics design engineers and manufacturing engineers are not well versed in adhesives, while adhesion chemists have a limited knowledge of electronics. This book bridges these knowledge gaps and is useful to both groups. The book includes chapters covering types of adhesive, the chemistry on which they are based, and their properties, applications, processes, specifications, and reliability. Coverage of toxicity, environmental impacts and the regulatory framework


Adhesives Technology for Electronic Applications

Adhesives Technology for Electronic Applications
  • Author : James J. Licari,Dale W. Swanson
  • Publisher : Elsevier
  • Release : 30 August 2005
GET THIS BOOKAdhesives Technology for Electronic Applications

This book is unique in its comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, such as dies, substrate, and lid and chip stack attachments, the book includes new developments in anisotropic, electrically conductive, and underfill adhesives. Rapid curing methods such as UV, microwave, and moisture (which comply with current environmental and energy requirements) are covered. Over 80 tables and 120 figures provide a wealth of


Engineered Materials Handbook

Engineered Materials Handbook
  • Author : Cyril A. Dostal,ASM International. Handbook Committee
  • Publisher : CRC Press
  • Release : 05 December 1990
GET THIS BOOKEngineered Materials Handbook

Engineering adhesives and sealants, as defined herein, are polymer resin-base materials used in the manufacturing industries for joining structural elements (or sealing joints between them) so that the joints themselves become load-bearing elements of the structural systems in which they are located


Applied Adhesive Bonding in Science and Technology

Applied Adhesive Bonding in Science and Technology
  • Author : Halil Ozer
  • Publisher : BoD – Books on Demand
  • Release : 21 February 2018
GET THIS BOOKApplied Adhesive Bonding in Science and Technology

This book brings together scientists and provides the reader with a comprehensive overview of some recent developments in the field of adhesive bonding with the contributions of internationally recognized authors. This book is divided into three sections: "Structural Adhesive Bonding," "Wood Adhesive Bonding," and "Adhesive Bonding in Medical Applications." Each section presents an important review and some applications of the adhesive bonding in various different disciplines. I hope that the book published in open access will help researchers to benefit


Nano-Bio- Electronic, Photonic and MEMS Packaging

Nano-Bio- Electronic, Photonic and MEMS Packaging
  • Author : C.P. Wong,Kyoung-Sik Moon,Yi (Grace) Li
  • Publisher : Springer Science & Business Media
  • Release : 23 December 2009
GET THIS BOOKNano-Bio- Electronic, Photonic and MEMS Packaging

Nanotechnologies are being applied to the biotechnology area, especially in the area of nano material synthesis. Until recently, there has been little research into how to implement nano/bio materials into the device level. “Nano and Bio Electronics Packaging” discusses how nanofabrication techniques can be used to customize packaging for nano devices with applications to biological and biomedical research and products. Covering such topics as nano bio sensing electronics, bio device packaging, NEMs for Bio Devices and much more.


Electrically Conductive Adhesives

Electrically Conductive Adhesives
  • Author : Rajesh Gomatam,Kashmiri Lal Mittal
  • Publisher : BRILL
  • Release : 23 December 2008
GET THIS BOOKElectrically Conductive Adhesives

This book is based on two Special Issues of the Journal of Adhesion Science and Technology (JAST vol. 22, no. 8-9 and vol. 22, no. 14) dedicated to the logic of electrically conductive adhesives. The contains a total of 21 papers (reflecting overviews and original research).