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Advances in Chemical Mechanical Planarization CMP

Advances in Chemical Mechanical Planarization  CMP
  • Author : Suryadevara Babu
  • Publsiher : Woodhead Publishing
  • Release : 09 January 2016
  • ISBN : 0081002181
  • Pages : 536 pages
  • Rating : 4/5 from 1 ratings
GET THIS BOOKAdvances in Chemical Mechanical Planarization CMP

Summary:
Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planarization of multiple metal and dielectric materials and layers both at the device and the metallization levels, using different tools and parameters, requiring improvements in the control of topography and defects. This important book offers a systematic review of fundamentals and advances in the area. Part One covers CMP of dielectric and metal films, with chapters focusing on the use of particular techniques and processes, and on CMP of particular various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. Part Two addresses consumables and process control for improved CMP, and includes chapters on the preparation and characterization of slurry, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes, and approaches for defection characterization, mitigation, and reduction. Considers techniques and processes for CMP of dielectric and metal films Includes chapters devoted to CMP for particular materials Addresses consumables and process control for improved CMP


Advances in Chemical Mechanical Planarization (CMP)

Advances in Chemical Mechanical Planarization (CMP)
  • Author : Suryadevara Babu
  • Publisher : Woodhead Publishing
  • Release : 09 January 2016
GET THIS BOOKAdvances in Chemical Mechanical Planarization (CMP)

Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planarization of multiple metal and dielectric materials and layers both at the device and the metallization levels, using different tools and parameters, requiring improvements in the control of topography and defects. This important book offers a systematic review of



Advances in CMP/polishing Technologies for the Manufacture of Electronic Devices

Advances in CMP/polishing Technologies for the Manufacture of Electronic Devices
  • Author : Toshiro Doi,Ioan D. Marinescu,Syuhei Kurokawa
  • Publisher : William Andrew
  • Release : 01 December 2011
GET THIS BOOKAdvances in CMP/polishing Technologies for the Manufacture of Electronic Devices

CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field - making cutting-edge R&D accessible to the wider engineering community. Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This


Microelectronic Applications of Chemical Mechanical Planarization

Microelectronic Applications of Chemical Mechanical Planarization
  • Author : Yuzhuo Li
  • Publisher : John Wiley & Sons
  • Release : 19 October 2007
GET THIS BOOKMicroelectronic Applications of Chemical Mechanical Planarization

An authoritative, systematic, and comprehensive description of current CMP technology Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of any known technique. The current standard for integrated circuit (IC) planarization, CMP is playing an increasingly important role in other related applications such as microelectromechanical systems (MEMS) and computer hard drive manufacturing. This reference focuses on the chemical aspects of the technology and includes contributions from the foremost experts on specific applications. After a detailed overview of the fundamentals



Chemical-Mechanical Planarization of Semiconductor Materials

Chemical-Mechanical Planarization of Semiconductor Materials
  • Author : M.R. Oliver
  • Publisher : Springer Science & Business Media
  • Release : 26 January 2004
GET THIS BOOKChemical-Mechanical Planarization of Semiconductor Materials

This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.



Abrasive Technology

Abrasive Technology
  • Author : Anna Rudawska
  • Publisher : BoD – Books on Demand
  • Release : 24 October 2018
GET THIS BOOKAbrasive Technology

The subject matter of this book is the information on the abrasive technology methods, the characteristics of the methods (for example, the technological parameters, tools, and machines), innovative methods, characteristics of surface structure and surface properties after this type of mechanical process, and application in various industrial branches and other technical and technological domains. Abrasive technology is very important, for example, in precision component manufacturing and nano-technology devices. The aim of this book is to present information on the characteristics



Advances in Abrasive Based Machining and Finishing Processes

Advances in Abrasive Based Machining and Finishing Processes
  • Author : S. Das,G. Kibria,B. Doloi,B. Bhattacharyya
  • Publisher : Springer Nature
  • Release : 10 May 2020
GET THIS BOOKAdvances in Abrasive Based Machining and Finishing Processes

This book presents the advances in abrasive based machining and finishing in broad sense. Specifically, the book covers the novel machining and finishing strategies implemented in various advanced machining processes for improving machining accuracy and overall quality of the product. This book presents the capability of advanced machining processes using abrasive grain. It also covers ways for enhancing the production rate as well as quality. It fulfills the gap between the production of any complicated components and successful machining with


Microelectronic Packaging

Microelectronic Packaging
  • Author : M. Datta,Tetsuya Osaka,J. Walter Schultze
  • Publisher : CRC Press
  • Release : 20 December 2004
GET THIS BOOKMicroelectronic Packaging

Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metallization. Divided into five parts, the book begins by outlining the basics of electrochemical processing, defining the microelectronic packaging hierarchy, and emphasizing the impact of


Advances in Manufacturing Technology XXXIII

Advances in Manufacturing Technology XXXIII
  • Author : Y. Jin,M. Price
  • Publisher : IOS Press
  • Release : 22 August 2019
GET THIS BOOKAdvances in Manufacturing Technology XXXIII

The development and management of technologies and operations are key to the success of all types of manufacturing business. This book presents the proceedings of the 17th International Conference on Manufacturing Research (ICMR 2019), held in Belfast, UK, on 10 – 12 September 2019. ICMR has been the UK’s main manufacturing research conference for 34 years and an international conference since 2003. It brings together researchers, academics and industrialists to share their vision, knowledge and experience and discuss emerging trends and new challenges in manufacturing research.


Advances in Chemical, Material and Metallurgical Engineering

Advances in Chemical, Material and Metallurgical Engineering
  • Author : Jian Min Zeng,Hong Xi Zhu,Jian Yi Kong
  • Publisher : Trans Tech Publications Ltd
  • Release : 11 January 2013
GET THIS BOOKAdvances in Chemical, Material and Metallurgical Engineering

Volume is indexed by Thomson Reuters CPCI-S (WoS). The 5 volumes set contains selected, peer reviewed papers from the 2012 2nd International Conference on Chemical, Material and Metallurgical Engineering (ICCMME 2012), December 15-16, 2012, Kunming, P.R. of China. The ICCMME series provide the most up-to-date and authoritative knowledge from both industrial and academic worlds, sharing best practice in the field of Chemical Engineering, Chemistry, Materials and Materials Processing and Metallurgical Engineering. The meeting provided an opportunity to highlight recent developments and to identify


MEMS Materials and Processes Handbook

MEMS Materials and Processes Handbook
  • Author : Reza Ghodssi,Pinyen Lin
  • Publisher : Springer Science & Business Media
  • Release : 18 March 2011
GET THIS BOOKMEMS Materials and Processes Handbook

MEMs Materials and Processes Handbook" is a comprehensive reference for researchers searching for new materials, properties of known materials, or specific processes available for MEMS fabrication. The content is separated into distinct sections on "Materials" and "Processes". The extensive Material Selection Guide" and a "Material Database" guides the reader through the selection of appropriate materials for the required task at hand. The "Processes" section of the book is organized as a catalog of various microfabrication processes, each with a brief


Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect

This thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material. Pursuing a systematic approach to resolve the remaining critical issues in the CMP, it first investigates the tribocorrosion properties and the material removal mechanisms of copper (Cu) and Ru in KIO4-based slurry. The thesis subsequently studies Cu/Ru galvanic corrosion from a new micro and in-situ perspective, and on this basis, seeks ways to