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Advances in CMP/polishing Technologies for the Manufacture of Electronic Devices

Advances in CMP/polishing Technologies for the Manufacture of Electronic Devices
  • Author : Toshiro Doi,Ioan D. Marinescu,Syuhei Kurokawa
  • Publisher : William Andrew
  • Release : 01 December 2011
GET THIS BOOKAdvances in CMP/polishing Technologies for the Manufacture of Electronic Devices

CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field - making cutting-edge R&D accessible to the wider engineering community. Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This


Advances in Chemical Mechanical Planarization (CMP)

Advances in Chemical Mechanical Planarization (CMP)
  • Author : Suryadevara Babu
  • Publisher : Woodhead Publishing
  • Release : 09 January 2016
GET THIS BOOKAdvances in Chemical Mechanical Planarization (CMP)

Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planarization of multiple metal and dielectric materials and layers both at the device and the metallization levels, using different tools and parameters, requiring improvements in the control of topography and defects. This important book offers a systematic review of



Abrasive Technology

Abrasive Technology
  • Author : Anna Rudawska
  • Publisher : BoD – Books on Demand
  • Release : 24 October 2018
GET THIS BOOKAbrasive Technology

The subject matter of this book is the information on the abrasive technology methods, the characteristics of the methods (for example, the technological parameters, tools, and machines), innovative methods, characteristics of surface structure and surface properties after this type of mechanical process, and application in various industrial branches and other technical and technological domains. Abrasive technology is very important, for example, in precision component manufacturing and nano-technology devices. The aim of this book is to present information on the characteristics


Chemical-Mechanical Planarization of Semiconductor Materials

Chemical-Mechanical Planarization of Semiconductor Materials
  • Author : M.R. Oliver
  • Publisher : Springer Science & Business Media
  • Release : 26 January 2004
GET THIS BOOKChemical-Mechanical Planarization of Semiconductor Materials

This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.


Handbook of Semiconductor Manufacturing Technology

Handbook of Semiconductor Manufacturing Technology
  • Author : Yoshio Nishi,Robert Doering
  • Publisher : CRC Press
  • Release : 19 December 2017
GET THIS BOOKHandbook of Semiconductor Manufacturing Technology

Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available.


Microelectronic Applications of Chemical Mechanical Planarization

Microelectronic Applications of Chemical Mechanical Planarization
  • Author : Yuzhuo Li
  • Publisher : John Wiley & Sons
  • Release : 19 October 2007
GET THIS BOOKMicroelectronic Applications of Chemical Mechanical Planarization

An authoritative, systematic, and comprehensive description of current CMP technology Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of any known technique. The current standard for integrated circuit (IC) planarization, CMP is playing an increasingly important role in other related applications such as microelectromechanical systems (MEMS) and computer hard drive manufacturing. This reference focuses on the chemical aspects of the technology and includes contributions from the foremost experts on specific applications. After a detailed overview of the fundamentals


Advances in Chemical Mechanical Planarization (CMP)

Advances in Chemical Mechanical Planarization (CMP)
  • Author : Suryadevara Babu
  • Publisher : Woodhead Publishing
  • Release : 09 January 2016
GET THIS BOOKAdvances in Chemical Mechanical Planarization (CMP)

Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planarization of multiple metal and dielectric materials and layers both at the device and the metallization levels, using different tools and parameters, requiring improvements in the control of topography and defects. This important book offers a systematic review of


Design for Advanced Manufacturing: Technologies and Processes

Design for Advanced Manufacturing: Technologies and Processes
  • Author : LaRoux K. Gillespie
  • Publisher : McGraw Hill Professional
  • Release : 12 May 2017
GET THIS BOOKDesign for Advanced Manufacturing: Technologies and Processes

Cutting-edge coverage of the new processes, materials, and technologies that are revolutionizing the manufacturing industry Expertly edited by a past president of the Society of Manufacturing Engineers, this state-of-the-art resource picks up where the bestselling Design for Manufacturability Handbook left off. Within its pages, readers will find detailed, clearly written coverage of the materials, technologies, and processes that have been developed and adopted in the manufacturing industry over the past sixteen years. More than this, the book also includes hard-to-find


Ultra Clean Processing of Semiconductor Surfaces XIII

Ultra Clean Processing of Semiconductor Surfaces XIII
  • Author : Paul W. Mertens,Marc Meuris,Marc Heyns
  • Publisher : Trans Tech Publications Ltd
  • Release : 05 September 2016
GET THIS BOOKUltra Clean Processing of Semiconductor Surfaces XIII

This volume contains the proceedings of 13th International Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS 2016, Knokke, Belgium, September 12-14, 2016) (www.ucpss.org) and includes studies on cleaning such as particle removal using acoustic enhancement, removal of metallic contamination, pattern collapse of fine flexible and fragile features, wetting and drying issues, control and measuring of contamination . FEOL and BEOL topics cover: chemistry of semiconductor surfaces, cleaning related to new gate stacks, cleaning at the interconnect level, selective wet etching,


Advances in Manufacturing Technology XXXIII

Advances in Manufacturing Technology XXXIII
  • Author : Y. Jin,M. Price
  • Publisher : IOS Press
  • Release : 22 August 2019
GET THIS BOOKAdvances in Manufacturing Technology XXXIII

The development and management of technologies and operations are key to the success of all types of manufacturing business. This book presents the proceedings of the 17th International Conference on Manufacturing Research (ICMR 2019), held in Belfast, UK, on 10 – 12 September 2019. ICMR has been the UK’s main manufacturing research conference for 34 years and an international conference since 2003. It brings together researchers, academics and industrialists to share their vision, knowledge and experience and discuss emerging trends and new challenges in manufacturing research.


Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect

This thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material. Pursuing a systematic approach to resolve the remaining critical issues in the CMP, it first investigates the tribocorrosion properties and the material removal mechanisms of copper (Cu) and Ru in KIO4-based slurry. The thesis subsequently studies Cu/Ru galvanic corrosion from a new micro and in-situ perspective, and on this basis, seeks ways to


3D IC Stacking Technology

3D IC Stacking Technology
  • Author : Banqiu Wu,Ajay Kumar,Sesh Ramaswami
  • Publisher : McGraw Hill Professional
  • Release : 14 October 2011
GET THIS BOOK3D IC Stacking Technology

The latest advances in three-dimensional integrated circuit stacking technology With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers. 3D IC Stacking Technology covers: High density through


Novel Aspects of Diamond

Novel Aspects of Diamond
  • Author : Nianjun Yang
  • Publisher : Springer
  • Release : 02 April 2019
GET THIS BOOKNovel Aspects of Diamond

This book is in honor of the contribution of Professor Xin Jiang (Institute of Materials Engineering, University of Siegen, Germany) to diamond. The objective of this book is to familiarize readers with the scientific and engineering aspects of CVD diamond films and to provide experienced researchers, scientists, and engineers in academia and industry with the latest developments and achievements in this rapidly growing field. This 2nd edition consists of 14 chapters, providing an updated, systematic review of diamond research, ranging from


Noble and Precious Metals

Noble and Precious Metals
  • Author : Mohindar Seehra,Alan Bristow
  • Publisher : BoD – Books on Demand
  • Release : 04 July 2018
GET THIS BOOKNoble and Precious Metals

The use of copper, silver, gold and platinum in jewelry as a measure of wealth is well known. This book contains 19 chapters written by international authors on other uses and applications of noble and precious metals (copper, silver, gold, platinum, palladium, iridium, osmium, rhodium, ruthenium, and rhenium). The topics covered include surface-enhanced Raman scattering, quantum dots, synthesis and properties of nanostructures, and its applications in the diverse fields such as high-tech engineering, nanotechnology, catalysis, and biomedical applications. The basis for