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Advances in CMP polishing Technologies for the Manufacture of Electronic Devices

Advances in CMP polishing Technologies for the Manufacture of Electronic Devices
  • Author : Toshiro Doi
  • Publsiher : William Andrew
  • Release : 01 December 2011
  • ISBN : 1437778593
  • Pages : 317 pages
  • Rating : 4/5 from 21 ratings
GET THIS BOOKAdvances in CMP polishing Technologies for the Manufacture of Electronic Devices

Summary:
CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field - making cutting-edge R&D accessible to the wider engineering community. Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book makes these processes and applications accessible to a wider industrial and academic audience. Building on the fundamentals of tribology - the science of friction, wear and lubrication - the authors explore the practical applications of CMP and polishing across various market sectors. Due to the high pace of development of the electronics and semiconductors industry, many of the presented processes and applications come from these industries. Demystifies scientific developments and technological innovations, opening them up for new applications and process improvements in the semiconductor industry and other areas of precision engineering Explores stock removal mechanisms in CMP and polishing, and the challenges involved in predicting the outcomes of abrasive processes in high-precision environments The authors bring together the latest innovations and research from the USA and Japan


Advances in CMP/polishing Technologies for the Manufacture of Electronic Devices

Advances in CMP/polishing Technologies for the Manufacture of Electronic Devices
  • Author : Toshiro Doi,Ioan D. Marinescu,Syuhei Kurokawa
  • Publisher : William Andrew
  • Release : 01 December 2011
GET THIS BOOKAdvances in CMP/polishing Technologies for the Manufacture of Electronic Devices

CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field - making cutting-edge R&D accessible to the wider engineering community. Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This

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Advances in Chemical Mechanical Planarization (CMP)

Advances in Chemical Mechanical Planarization (CMP)
  • Author : Suryadevara Babu
  • Publisher : Woodhead Publishing
  • Release : 24 September 2021
GET THIS BOOKAdvances in Chemical Mechanical Planarization (CMP)

Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric

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Advances in CMP Polishing Technologies

Advances in CMP Polishing Technologies
  • Author : Toshiro Doi,Ioan D. Marinescu,Syuhei Kurokawa
  • Publisher : William Andrew
  • Release : 30 November 2011
GET THIS BOOKAdvances in CMP Polishing Technologies

CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field – making cutting-edge R&D accessible to the wider engineering community. Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book

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Chemical-Mechanical Planarization of Semiconductor Materials

Chemical-Mechanical Planarization of Semiconductor Materials
  • Author : M.R. Oliver
  • Publisher : Springer Science & Business Media
  • Release : 26 January 2004
GET THIS BOOKChemical-Mechanical Planarization of Semiconductor Materials

This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.

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Handbook of Lapping and Polishing

Handbook of Lapping and Polishing
  • Author : Ioan D. Marinescu,Eckart Uhlmann,Toshiro Doi
  • Publisher : CRC Press
  • Release : 20 November 2006
GET THIS BOOKHandbook of Lapping and Polishing

Lapping and polishing are currently the most precise surface finishing processes for mechanical and electronic components. Unfortunately, most improvements in either methods or understanding of the physical processes involved are closely guarded as proprietary information. The Handbook of Lapping and Polishing is the first source in English to bring to the light of day the physical fundamentals and advanced technologies at the leading edge of modern lapping and polishing practice. Collecting decisive work contributed by industrial and academic experts from

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Abrasive Technology

Abrasive Technology
  • Author : Anna Rudawska
  • Publisher : BoD – Books on Demand
  • Release : 24 October 2018
GET THIS BOOKAbrasive Technology

The subject matter of this book is the information on the abrasive technology methods, the characteristics of the methods (for example, the technological parameters, tools, and machines), innovative methods, characteristics of surface structure and surface properties after this type of mechanical process, and application in various industrial branches and other technical and technological domains. Abrasive technology is very important, for example, in precision component manufacturing and nano-technology devices. The aim of this book is to present information on the characteristics

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Advances in Abrasive Based Machining and Finishing Processes

Advances in Abrasive Based Machining and Finishing Processes
  • Author : S. Das,G. Kibria,B. Doloi,B. Bhattacharyya
  • Publisher : Springer Nature
  • Release : 10 May 2020
GET THIS BOOKAdvances in Abrasive Based Machining and Finishing Processes

This book presents the advances in abrasive based machining and finishing in broad sense. Specifically, the book covers the novel machining and finishing strategies implemented in various advanced machining processes for improving machining accuracy and overall quality of the product. This book presents the capability of advanced machining processes using abrasive grain. It also covers ways for enhancing the production rate as well as quality. It fulfills the gap between the production of any complicated components and successful machining with

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Chemical Mechanical Planarization of Microelectronic Materials

Chemical Mechanical Planarization of Microelectronic Materials
  • Author : Joseph M. Steigerwald,Shyam P. Murarka,Ronald J. Gutmann
  • Publisher : John Wiley & Sons
  • Release : 26 September 2008
GET THIS BOOKChemical Mechanical Planarization of Microelectronic Materials

Chemical Mechanical Planarization (CMP) plays an important role in today's microelectronics industry. With its ability to achieve global planarization, its universality (material insensitivity), its applicability to multimaterial surfaces, and its relative cost-effectiveness, CMP is the ideal planarizing medium for the interlayered dielectrics and metal films used in silicon integrated circuit fabrication. But although the past decade has seen unprecedented research and development into CMP, there has been no single-source reference to this rapidly emerging technology-until now. Chemical Mechanical Planarization of

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Wafer Manufacturing: Shaping of Single Crystal Silicon Wafers

Wafer Manufacturing: Shaping of Single Crystal Silicon Wafers
  • Author : Imin Cao,Milind Bhagavat
  • Publisher : John Wiley & Sons
  • Release : 22 March 2021
GET THIS BOOKWafer Manufacturing: Shaping of Single Crystal Silicon Wafers

Presenting all the major stages in wafer manufacturing, from crystals to prime wafers. This book first outlines the physics, associated metrology, process modelling and quality requirements and the goes on to discuss wafer forming and wafer surface preparation techniques. The whole is rounded off with a chapter on the research and future challenges in wafer manufacturing.

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Tribocorrosion of Passive Metals and Coatings

Tribocorrosion of Passive Metals and Coatings
  • Author : D Landolt,S Mischler
  • Publisher : Elsevier
  • Release : 12 October 2011
GET THIS BOOKTribocorrosion of Passive Metals and Coatings

Tribocorrosion causes the degradation or alteration of materials through the combined action of corrosion and wear. It limits the performance and life-time of installations, machines and devices with moving parts, and controls certain manufacturing processes such as chemical–mechanical polishing. The effects of tribocorrosion are most pronounced on passive metals which owe their corrosion resistance to a thin protecting oxide film. Most corrosion-resistant engineering alloys belong to this category. This book provides an introduction to the developing field of tribocorrosion

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Semiconductor Manufacturing Technology

Semiconductor Manufacturing Technology
  • Author : Chue San Yoo
  • Publisher : World Scientific
  • Release : 26 June 2022
GET THIS BOOKSemiconductor Manufacturing Technology

This textbook contains all the materials that an engineer needs to know to start a career in the semiconductor industry. It also provides readers with essential background information for semiconductor research. It is written by a professional who has been working in the field for over two decades and teaching the material to university students for the past 15 years. It includes process knowledge from raw material preparation to the passivation of chips in a modular format.

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Introduction to Semiconductor Manufacturing Technology

Introduction to Semiconductor Manufacturing Technology
  • Author : Hong Xiao
  • Publisher : Anonim
  • Release : 26 June 2022
GET THIS BOOKIntroduction to Semiconductor Manufacturing Technology

For courses in Semiconductor Manufacturing Technology, IC Fabrication Technology, and Devices: Conventional Flow. This up-to-date text on semiconductor manufacturing processes takes into consideration the rapid development of the industry's technology. It thoroughly describes the complicated and new IC chip fabrication processes in detail with minimum mathematics, physics, and chemistry. Advanced technologies are covered along with older ones to assist students in understanding the development processes from a historic point of view.

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Tribology of Abrasive Machining Processes

Tribology of Abrasive Machining Processes
  • Author : Ioan D. Marinescu
  • Publisher : William Andrew
  • Release : 04 December 2012
GET THIS BOOKTribology of Abrasive Machining Processes

This book draws upon the science of tribology to understand, predict and improve abrasive machining processes. Pulling together information on how abrasives work, the authors, who are renowned experts in abrasive technology, demonstrate how tribology can be applied as a tool to improve abrasive machining processes. Each of the main elements of the abrasive machining system are looked at, and the tribological factors that control the efficiency and quality of the processes are described. Since grinding is by far the

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Introduction to Microfabrication

Introduction to Microfabrication
  • Author : Sami Franssila
  • Publisher : John Wiley & Sons
  • Release : 28 January 2005
GET THIS BOOKIntroduction to Microfabrication

Microfabrication is the key technology behind integrated circuits, microsensors, photonic crystals, ink jet printers, solar cells and flat panel displays. Microsystems can be complex, but the basic microstructures and processes of microfabrication are fairly simple. Introduction to Microfabrication shows how the common microfabrication concepts can be applied over and over again to create devices with a wide variety of structures and functions. Featuring: * A comprehensive presentation of basic fabrication processes * An emphasis on materials and microstructures, rather than device physics *

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Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect

This thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material. Pursuing a systematic approach to resolve the remaining critical issues in the CMP, it first investigates the tribocorrosion properties and the material removal mechanisms of copper (Cu) and Ru in KIO4-based slurry. The thesis subsequently studies Cu/Ru galvanic corrosion from a new micro and in-situ perspective, and on this basis, seeks ways to

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