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Electronic Enclosures Housings and Packages

Electronic Enclosures  Housings and Packages
  • Author : Frank Suli
  • Publsiher : Woodhead Publishing
  • Release : 15 November 2018
  • ISBN : 008102391X
  • Pages : 562 pages
  • Rating : 4/5 from 21 ratings
GET THIS BOOKElectronic Enclosures Housings and Packages

Summary:
Electronic Enclosures, Housings and Packages considers the problem of heat management for electronics from an encasement perspective. It addresses enclosures and their applications for industrial electronics, as well as LED lighting solutions for stationary and mobile markets. The book introduces fundamental concepts and defines dimensions of success in electrical enclosures. Other chapters discuss environmental considerations, shielding, standardization, materials selection, thermal management, product design principles, manufacturing techniques and sustainability. Final chapters focus on business fundamentals by outlining successful technical propositions and potential future directions. Introduces the concepts of materials recycling and sustainability to electronic enclosures Provides thorough coverage of all technical aspects relating to the design and manufacturing of electronic packaging Includes practical information on environmental considerations, shielding, standardization, materials selection, and more


Electronic Enclosures, Housings and Packages

Electronic Enclosures, Housings and Packages
  • Author : Frank Suli
  • Publisher : Woodhead Publishing
  • Release : 15 November 2018
GET THIS BOOKElectronic Enclosures, Housings and Packages

Electronic Enclosures, Housings and Packages considers the problem of heat management for electronics from an encasement perspective. It addresses enclosures and their applications for industrial electronics, as well as LED lighting solutions for stationary and mobile markets. The book introduces fundamental concepts and defines dimensions of success in electrical enclosures. Other chapters discuss environmental considerations, shielding, standardization, materials selection, thermal management, product design principles, manufacturing techniques and sustainability. Final chapters focus on business fundamentals by outlining successful technical propositions and

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Advanced Rare Earth-Based Ceramic Nanomaterials

Advanced Rare Earth-Based Ceramic Nanomaterials
  • Author : Sahar Zinatloo-Ajabshir
  • Publisher : Elsevier
  • Release : 15 January 2022
GET THIS BOOKAdvanced Rare Earth-Based Ceramic Nanomaterials

Advanced Rare Earth-Based Ceramic Nanomaterials focuses on recent advances related to preparation methods and applications of advanced rare earth-based ceramic nanomaterials. Different approaches for synthesizing rare earth-based ceramic nanomaterials are discussed, along with their advantages and disadvantages for applications in various fields. Sections cover rare earth-based ceramic nanomaterials like ceria and rare earth oxides (R2O3), rare earth vanadates, rare earth titanates, rare earth zirconates, rare earth stannates, rare earth-based tungstates, rare earth-based manganites, ferrites, cobaltites, nickelates, rare earth doped

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Handbook of Electronic Package Design

Handbook of Electronic Package Design
  • Author : Michael Pecht
  • Publisher : CRC Press
  • Release : 24 October 2018
GET THIS BOOKHandbook of Electronic Package Design

Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development

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Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
  • Author : Ephraim Suhir,Y.C. Lee,C.P. Wong
  • Publisher : Springer Science & Business Media
  • Release : 26 May 2007
GET THIS BOOKMicro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging

This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such

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Cost-Driven Design of Smart Microsystems

Cost-Driven Design of Smart Microsystems
  • Author : Michael Niedermayer
  • Publisher : Artech House
  • Release : 01 January 2011
GET THIS BOOKCost-Driven Design of Smart Microsystems

TodayOCOs professionals are constantly striving to create sensor technology and systems with lower cost and higher efficiency. Miniaturization and standardization have become critical drivers for cost reduction in the design and development process, giving rise to a new era of smart sensors and actuators. These devices contain more components, but normally provide significant cost savings due to wider applicability and mass production. This first-of-its-kind resource presents methods for cost optimization of smart microsystems to help you select highly cost-efficient implementation

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Future Prospects for Industrial Biotechnology

Future Prospects for Industrial Biotechnology
  • Author : OECD
  • Publisher : OECD Publishing
  • Release : 16 September 2011
GET THIS BOOKFuture Prospects for Industrial Biotechnology

This publication examines the international drivers, the enabling technologies that are fast-tracking Industrial Biotechnology, industry trends, some of the products that are appearing on the market, industry structure and finance, and finally policy measures and trends.

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Electronic Packaging Materials and Their Properties

Electronic Packaging Materials and Their Properties
  • Author : Michael Pecht,Rakish Agarwal,F. Patrick McCluskey,Terrance J. Dishongh,Sirus Javadpour,Rahul Mahajan
  • Publisher : CRC Press
  • Release : 19 December 2017
GET THIS BOOKElectronic Packaging Materials and Their Properties

Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation. Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include:

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Polymers for 3D Printing

Polymers for 3D Printing
  • Author : Joanna Izdebska-PodsiadÅ‚y
  • Publisher : William Andrew
  • Release : 05 June 2022
GET THIS BOOKPolymers for 3D Printing

Polymers for 3D Printing: Methods, Properties, and Characteristics provides a detailed guide to polymers for 3D printing, bridging the gap between research and practice, and enabling engineers, technicians and designers to utilise and implement this technology for their products or applications. Presents the properties, attributes, and potential applications of the polymeric materials used in 3D printing Analyses and compares the available methods for 3D printing, with an emphasis on the latest cutting-edge technologies Enables the reader to select and implement

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Encapsulation Technologies for Electronic Applications

Encapsulation Technologies for Electronic Applications
  • Author : Haleh Ardebili,Jiawei Zhang,Michael Pecht
  • Publisher : William Andrew
  • Release : 23 October 2018
GET THIS BOOKEncapsulation Technologies for Electronic Applications

Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to

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