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Hermeticity of Electronic Packages

Hermeticity of Electronic Packages
  • Author : Hal Greenhouse
  • Publisher : William Andrew
  • Release : 17 January 2022
GET THIS BOOKHermeticity of Electronic Packages

This is a book about the integrity of sealed packages to resist foreign gases and liquids penetrating the seal or an opening (crack) in the package�especially critical to the reliability and longevity of electronics. The author explains how to predict the reliability and the longevity of the packages based on leak rate measurements and the assumptions of impurities. Non-specialists in particular will benefit from the author's long involvement in the technology. Hermeticity is a subject that demands practical experience,

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Hermeticity of Electronic Packages

Hermeticity of Electronic Packages
  • Author : Hal Greenhouse
  • Publisher : William Andrew
  • Release : 05 October 2011
GET THIS BOOKHermeticity of Electronic Packages

This is a book about the integrity of sealed packages to resist foreign gases and liquids penetrating the seal or an opening (crack) in the packageùespecially critical to the reliability and longevity of electronics. The author explains how to predict the reliability and the longevity of the packages based on leak rate measurements and the assumptions of impurities. Non-specialists in particular will benefit from the author's long involvement in the technology. Hermeticity is a subject that demands practical experience,

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Hermeticity Testing of MEMS and Microelectronic Packages

Hermeticity Testing of MEMS and Microelectronic Packages
  • Author : Suzanne Costello,Marc P.Y. Desmulliez
  • Publisher : Artech House
  • Release : 01 October 2013
GET THIS BOOKHermeticity Testing of MEMS and Microelectronic Packages

Packaging of microelectronics has been developing since the invention of the transistor in 1947. With the increasing complexity and decreasing size of the die, packaging requirements have continued to change. A step change in package requirements came with the introduction of the Micro-Electro-Mechanical System (MEMS) whereby interactions with the external environment are, in some cases, required. This resource is a rapid, definitive reference on hermetic packaging for the MEMS and microelectronics industry, giving practical guidance on traditional and newly developed test

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Handbook of Silicon Based MEMS Materials and Technologies

Handbook of Silicon Based MEMS Materials and Technologies
  • Author : Markku Tilli,Mervi Paulasto-Krockel,Teruaki Motooka,Veikko Lindroos
  • Publisher : William Andrew
  • Release : 02 September 2015
GET THIS BOOKHandbook of Silicon Based MEMS Materials and Technologies

The Handbook of Silicon Based MEMS Materials and Technologies, Second Edition, is a comprehensive guide to MEMS materials, technologies, and manufacturing that examines the state-of-the-art with a particular emphasis on silicon as the most important starting material used in MEMS. The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, manufacturing, processing, system integration, measurement, and materials characterization techniques, sensors, and multi-scale modeling methods of MEMS structures, silicon crystals, and wafers, also covering micromachining technologies in MEMS

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Handbook of Electronic Package Design

Handbook of Electronic Package Design
  • Author : Michael Pecht
  • Publisher : CRC Press
  • Release : 24 October 2018
GET THIS BOOKHandbook of Electronic Package Design

Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development

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Encapsulation Technologies for Electronic Applications

Encapsulation Technologies for Electronic Applications
  • Author : Haleh Ardebili,Jiawei Zhang,Michael Pecht
  • Publisher : William Andrew
  • Release : 23 October 2018
GET THIS BOOKEncapsulation Technologies for Electronic Applications

Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to

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Advanced RF MEMS

Advanced RF MEMS
  • Author : Stepan Lucyszyn
  • Publisher : Cambridge University Press
  • Release : 19 August 2010
GET THIS BOOKAdvanced RF MEMS

An up-to-date guide to the theory and applications of RF MEMS. With detailed information about RF MEMS technology as well as its reliability and applications, this is a comprehensive resource for professionals, researchers, and students alike. • Reviews RF MEMS technologies • Illustrates new techniques that solve long-standing problems associated with reliability and packaging • Provides the information needed to incorporate RF MEMS into commercial products • Describes current and future trends in RF MEMS, providing perspective on industry growth • Ideal for those studying

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Fundamentals of Microfabrication and Nanotechnology, Three-Volume Set

Fundamentals of Microfabrication and Nanotechnology, Three-Volume Set
  • Author : Marc J. Madou
  • Publisher : CRC Press
  • Release : 14 December 2018
GET THIS BOOKFundamentals of Microfabrication and Nanotechnology, Three-Volume Set

Now in its third edition, Fundamentals of Microfabrication and Nanotechnology continues to provide the most complete MEMS coverage available. Thoroughly revised and updated the new edition of this perennial bestseller has been expanded to three volumes, reflecting the substantial growth of this field. It includes a wealth of theoretical and practical information on nanotechnology and NEMS and offers background and comprehensive information on materials, processes, and manufacturing options. The first volume offers a rigorous theoretical treatment of micro- and nanosciences,

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Industrial Applications of Lasers

Industrial Applications of Lasers
  • Author : John F. Ready
  • Publisher : Elsevier
  • Release : 25 April 1997
GET THIS BOOKIndustrial Applications of Lasers

A practical book with a variety of uses, this book can help applications engineers spark problem-solving techniques through the use of lasers. Industrial Application of Lasers, Second Edition takes the reader through laser fundamentals, unusual properties of laser light, types of practical lasers available, and commonly used accessory equipment. The book also applies this information to existing and developing applications. Current uses of lasers, including laser welding and cutting, electronic fabrication techniques, lightwave communications, laser-based applications in alignment, surveying, and

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Sensor Systems Simulations

Sensor Systems Simulations
  • Author : Willem Dirk van Driel,Oliver Pyper,Cornelia Schumann
  • Publisher : Springer
  • Release : 18 June 2019
GET THIS BOOKSensor Systems Simulations

This book describes for readers various technical outcomes from the EU-project IoSense. The authors discuss sensor integration, including LEDs, dust sensors, LIDAR for automotive driving and 8 more, demonstrating their use in simulations for the design and fabrication of sensor systems. Readers will benefit from the coverage of topics such as sensor technologies for both discrete and integrated innovative sensor devices, suitable for high volume production, electrical, mechanical, security and software resources for integration of sensor system components into IoT systems

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Advanced Materials for Thermal Management of Electronic Packaging

Advanced Materials for Thermal Management of Electronic Packaging
  • Author : Xingcun Colin Tong
  • Publisher : Springer Science & Business Media
  • Release : 05 January 2011
GET THIS BOOKAdvanced Materials for Thermal Management of Electronic Packaging

The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining

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Mechanical Analysis of Electronic Packaging Systems

Mechanical Analysis of Electronic Packaging Systems
  • Author : Mckeown
  • Publisher : CRC Press
  • Release : 06 April 1999
GET THIS BOOKMechanical Analysis of Electronic Packaging Systems

"Fills the niche between purely technical engineering texts and sophisticated engineering software guides-providing a pragmatic, common sense approach to analyzing and remedying electronic packaging configuration problems. Combines classical engineering techniques with modern computing to achieve optimum results in assessment cost and accuracy."

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Electronic Packaging Materials and Their Properties

Electronic Packaging Materials and Their Properties
  • Author : Michael Pecht,Rakish Agarwal,F. Patrick McCluskey,Terrance J. Dishongh,Sirus Javadpour,Rahul Mahajan
  • Publisher : CRC Press
  • Release : 19 December 2017
GET THIS BOOKElectronic Packaging Materials and Their Properties

Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation. Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include:

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