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High Power Impulse Magnetron Sputtering

High Power Impulse Magnetron Sputtering
  • Author : Daniel Lundin,Jon Tomas Gudmundsson,Tiberiu Minea
  • Publisher : Anonim
  • Release : 13 September 2019
GET THIS BOOKHigh Power Impulse Magnetron Sputtering

High Power Impulse Magnetron Sputtering: Fundamentals, Technologies, Challenges and Applications is an in-depth introduction to HiPIMS that emphasizes how this novel sputtering technique differs from conventional magnetron processes in terms of both discharge physics and the resulting thin film characteristics. Ionization of sputtered atoms is discussed in detail for various target materials. In addition, the role of self-sputtering, secondary electron emission and the importance of controlling the process gas dynamics, both inert and reactive gases, are examined in detail with

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High Power Impulse Magnetron Sputtering

High Power Impulse Magnetron Sputtering
  • Author : Daniel Lundin,Tiberiu Minea,Jon Tomas Gudmundsson
  • Publisher : Elsevier
  • Release : 28 August 2019
GET THIS BOOKHigh Power Impulse Magnetron Sputtering

High Power Impulse Magnetron Sputtering: Fundamentals, Technologies, Challenges and Applications is an in-depth introduction to HiPIMS that emphasizes how this novel sputtering technique differs from conventional magnetron processes in terms of both discharge physics and the resulting thin film characteristics. Ionization of sputtered atoms is discussed in detail for various target materials. In addition, the role of self-sputtering, secondary electron emission and the importance of controlling the process gas dynamics, both inert and reactive gases, are examined in detail with

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Discharge Physics of High Power Impulse Magnetron Sputtering

Discharge Physics of High Power Impulse Magnetron Sputtering
  • Author : Anonim
  • Publisher : Anonim
  • Release : 17 January 2022
GET THIS BOOKDischarge Physics of High Power Impulse Magnetron Sputtering

High power impulse magnetron sputtering (HIPIMS) is pulsed sputtering where the peak power exceeds the time-averaged power by typically two orders of magnitude. The peak power density, averaged over the target area, can reach or exceed 107 W/m2, leading to plasma conditions that make ionization of the sputtered atoms very likely. A brief review of HIPIMS operation is given in a tutorial manner, illustrated by some original data related to the self-sputtering of niobium in argon and krypton. Emphasis is

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Ionized Physical Vapor Deposition

Ionized Physical Vapor Deposition
  • Author : Anonim
  • Publisher : Academic Press
  • Release : 14 October 1999
GET THIS BOOKIonized Physical Vapor Deposition

This volume provides the first comprehensive look at a pivotal new technology in integrated circuit fabrication. For some time researchers have sought alternate processes for interconnecting the millions of transistors on each chip because conventional physical vapor deposition can no longer meet the specifications of today's complex integrated circuits. Out of this research, ionized physical vapor deposition has emerged as a premier technology for the deposition of thin metal films that form the dense interconnect wiring on state-of-the-art microprocessors and

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Reactive Sputter Deposition

Reactive Sputter Deposition
  • Author : Diederik Depla,Stijn Mahieu
  • Publisher : Springer Science & Business Media
  • Release : 24 June 2008
GET THIS BOOKReactive Sputter Deposition

In this valuable work, all aspects of the reactive magnetron sputtering process, from the discharge up to the resulting thin film growth, are described in detail, allowing the reader to understand the complete process. Hence, this book gives necessary information for those who want to start with reactive magnetron sputtering, understand and investigate the technique, control their sputtering process and tune their existing process, obtaining the desired thin films.

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A Review Comparing Cathodic Arcs and High Power Impulse Magnetron Sputtering (HiPIMS).

High power impulse magnetron sputtering (HiPIMS) has been in the center of attention over the last years as it is an emerging physical vapor deposition (PVD) technology that combines advantages of magnetron sputtering with various forms of energetic deposition of films such as ion plating and cathodic arc plasma deposition. It should not come at a surprise that many extension and variations of HiPIMS make use, intentionally or unintentionally, of previously discovered approaches to film processing such as substrate surface

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Deposition Rates of High Power Impulse Magnetron Sputtering

Deposition Rates of High Power Impulse Magnetron Sputtering
  • Author : Anonim
  • Publisher : Anonim
  • Release : 17 January 2022
GET THIS BOOKDeposition Rates of High Power Impulse Magnetron Sputtering

Deposition by high power impulse magnetron sputtering (HIPIMS) is considered by some as the new paradigm of advanced sputtering technology, yet this is met with skepticism by others for the reported lower deposition rates, if compared to rates of more conventional sputtering of equal average power. In this contribution, the underlying physical reasons for the rate changes are discussed, including (i) ion return to the target and self-sputtering, (ii) the less-than-linear increase of the sputtering yield with increasing ion energy, (

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High Power Impulse Magnetron Sputtering

High Power Impulse Magnetron Sputtering
  • Author : Anonim
  • Publisher : Anonim
  • Release : 17 January 2022
GET THIS BOOKHigh Power Impulse Magnetron Sputtering

The commonly used current-voltage characteristics are foundinadequate for describing the pulsed nature of the high power impulsemagnetron sputtering (HIPIMS) discharge, rather, the description needs tobe expanded to current-voltage-time characteristics for each initial gaspressure. Using different target materials (Cu, Ti, Nb, C, W, Al, Cr) anda pulsed constant-voltage supply it is shown that the HIPIMS dischargestypically exhibit an initial pressure dependent current peak followed bya second phase that is power and material dependent. This suggests thatthe initial phase of a HIPIMS

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High Power Impulse Magnetron Sputtering and Related Discharges

High Power Impulse Magnetron Sputtering and Related Discharges
  • Author : Anonim
  • Publisher : Anonim
  • Release : 17 January 2022
GET THIS BOOKHigh Power Impulse Magnetron Sputtering and Related Discharges

High power impulse magnetron sputtering (HIPIMS) and related self-sputtering techniques are reviewed from a viewpoint of plasma-based ion implantation and deposition (PBII & D). HIPIMS combines the classical, scalable sputtering technology with pulsed power, which is an elegant way of ionizing the sputtered atoms. Related approaches, such as sustained self-sputtering, are also considered. The resulting intense flux of ions to the substrate consists of a mixture of metal and gas ions when using a process gas, or of metal ions only

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