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Robust Design of Microelectronics Assemblies Against Mechanical Shock Temperature and Moisture

Robust Design of Microelectronics Assemblies Against Mechanical Shock  Temperature and Moisture
  • Author : E-H Wong
  • Publsiher : Woodhead Publishing
  • Release : 23 May 2015
  • ISBN : 0857099116
  • Pages : 482 pages
  • Rating : 4/5 from 21 ratings
GET THIS BOOKRobust Design of Microelectronics Assemblies Against Mechanical Shock Temperature and Moisture

Summary:
Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included. Discusses how the reliability of packaging components is a prime concern to electronics manufacturers Presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques Includes program files and macros for additional study


Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture
  • Author : E-H Wong,Y.-W. Mai
  • Publisher : Woodhead Publishing
  • Release : 23 May 2015
GET THIS BOOKRobust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are

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Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture: Effects of Temperature, Moisture and Mechanical Driving Forces


Cyber-Physical Systems: Design and Application for Industry 4.0

Cyber-Physical Systems: Design and Application for Industry 4.0
  • Author : Alla G. Kravets,Alexander A. Bolshakov,Maxim Shcherbakov
  • Publisher : Springer Nature
  • Release : 25 March 2021
GET THIS BOOKCyber-Physical Systems: Design and Application for Industry 4.0

This book consists of chapters dedicated to the questions of cyber-physical system design and its usage for the chemical industry and new material design. Also, the contribution of the book covers scientific research and their results for cyber-physical systems design and application in the energy domain and solutions regarding engineering education for cyber-physical systems design. The book offers unique content for researchers and practitioners who are looking for new knowledge and skills in the framework of Industry 4.0 solutions. The book

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Solder Joint Reliability

Solder Joint Reliability
  • Author : John H. Lau
  • Publisher : Springer Science & Business Media
  • Release : 27 November 2013
GET THIS BOOKSolder Joint Reliability

Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder

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Semiconductor Packaging

Semiconductor Packaging
  • Author : Andrea Chen,Randy Hsiao-Yu Lo
  • Publisher : CRC Press
  • Release : 19 April 2016
GET THIS BOOKSemiconductor Packaging

In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means

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Optimum Cooling of Data Centers

Optimum Cooling of Data Centers
  • Author : Jun Dai,Michael M. Ohadi,Diganta Das,Michael G. Pecht
  • Publisher : Springer Science & Business Media
  • Release : 20 November 2013
GET THIS BOOKOptimum Cooling of Data Centers

This book describes the use of free air cooling to improve the efficiency of, and cooling of, equipment for use in telecom infrastructures. Discussed at length is the cooling of communication installation rooms such as data centers or base stations, and this is intended as a valuable tool for the people designing and manufacturing key parts of communication networks. This book provides an introduction to current cooling methods used for energy reduction, and also compares present cooling methods in use

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Integrated Circuit Packaging, Assembly and Interconnections

Integrated Circuit Packaging, Assembly and Interconnections
  • Author : William Greig
  • Publisher : Springer Science & Business Media
  • Release : 24 April 2007
GET THIS BOOKIntegrated Circuit Packaging, Assembly and Interconnections

Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The book discusses the various packaging approaches, assembly options, and essential manufacturing technologies, among other relevant topics.

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Advanced Materials for Thermal Management of Electronic Packaging

Advanced Materials for Thermal Management of Electronic Packaging
  • Author : Xingcun Colin Tong
  • Publisher : Springer Science & Business Media
  • Release : 05 January 2011
GET THIS BOOKAdvanced Materials for Thermal Management of Electronic Packaging

The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining

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Die-Attach Materials for High Temperature Applications in Microelectronics Packaging

Die-Attach Materials for High Temperature Applications in Microelectronics Packaging
  • Author : Kim S. Siow
  • Publisher : Springer
  • Release : 29 January 2019
GET THIS BOOKDie-Attach Materials for High Temperature Applications in Microelectronics Packaging

This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to

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High Temperature Electronics

High Temperature Electronics
  • Author : F. Patrick McCluskey,Thomas Podlesak,Richard Grzybowski
  • Publisher : CRC Press
  • Release : 04 May 2018
GET THIS BOOKHigh Temperature Electronics

The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them. Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to

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